China International Packaging Products & Materials Expo(CIPPME) 2027

PACK FAIR 2027 — Shanghai International Packaging Exhibition

The 18th edition of PACK FAIR is a major trade event covering the entire packaging industry chain. Held at the Shanghai World Expo Exhibition Hall, it features650+ exhibitorsand expectsStylish household itemsincluding brand manufacturers, OEM/ODM/OBM factories, agents, wholesalers, and retailers.

Four Co-Located Themed Zones

• Yazdırma Teknolojisi— International Printing Technology Exhibition, one of China's most influential printing trade shows, now in its 19th edition.
• Etiket Expo— Asia-Pacific focused international label printing exhibition covering labels, processing, and related technologies.
• CIPPME— Packaging Products & Materials Exhibition, a leading trade platform targeting Asian and emerging markets (Southeast Asia, South America, Middle East, North Africa).
• INTPAK— Smart Packaging Industry Exhibition, focusing on packaging technology, machinery, and intelligent packaging solutions.

Önemli Örnekler & Kategoriler

Kategori	亮点
Gelişim Ürünleri	Various packaging products and materials
Kutlama Makinaları	Automated packaging equipment, silk-screen printing machines
Functional Fabrics	Inks, thermal transfer ribbons, printing equipment
Smart Packaging	Intelligent packaging solutions and innovations
Eco Packaging	Green, recyclable, and sustainable packaging materials
Lojistik Ambalaj	Express delivery and logistics packaging solutions

Öne Çıkan Geliştiriciler

Haoneng (packaging)

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Giriş veya stollar için kaydol

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Mağaza Haritası ve Yakınındaki Hoteller

Şanghais - Şanghais Dünya Fuarı İstirahat ve Konferans Merkezi, Şanghais, Çin