Uluslararası Elektronik ve Fotonik Mikrosystems 2026
InterPACK 2026, the flagship ASME Electronic and Photonic Packaging Division conference, will be held in‑person at the San Diego Marriott Mission Valley, California, from October 26‑29, 2026. The event showcases the full electronics‑packaging ecosystem, featuring exhibits and technical sessions on heterogeneous integration, data‑center and modular edge systems, information storage, extreme‑environment packaging, power/RF electronics, photonics, nanoscale heat transfer, and energy storage. Key categories include additive and printed electronics, flexible and wearable devices, intelligent modeling and simulation, micro/nano mechatronics, and Internet‑of‑Things applications. The program also covers next‑generation computing architectures, autonomous and electric vehicles, and advanced thermal management. Alongside paper presentations, the conference offers panels, workshops, tutorials, keynote talks, and a joint industry‑academia poster session, fostering collaboration among industry leaders, academia, national labs, and start‑ups.
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Hotel Map and Hotels Around
San Jose - Holiday Inn San Jose - Silikon Vadisi, Kaliforniya, ABD